Test Background
The purpose of the frequency sweep vibration test of semiconductor devices is to measure the impact of vibration on the device within a specified frequency range. It is a destructive test and is usually used for devices with cavities.
Zhongke Testing Environmental Reliability Experiment Center has a variety of mechanical and climatic testing equipment for semiconductor devices, has the capability of sweeping frequency vibration testing, and provides professional sweeping frequency vibration testing services for semiconductor devices and equipment.
Test method
The sample should be rigidly mounted on the shaking table and the leads and cables should be securely fastened to avoid introducing additional lead resonances. The sample should be made to vibrate in simple harmonic motion, with twice the amplitude of 1.5 mm (peak-to-peak), or with a peak acceleration of 200 m/s2, whichever is smaller. The vibration frequency changes approximately logarithmically in the range of 20 Hz~2 000 Hz.
The vibration time of the entire frequency range from 20 Hz to 2 000 Hz and back to 20 Hz should not be less than 4 minutes. Perform this cycle 4 times in each of the 3 directions: X, Y, and Z (12 times in total).
Test standard:
GB/T 4937.1-2006 Mechanical and climatic test methods for semiconductor devices Part 1: General
GB/T 4937.12-2012 Mechanical and climatic test methods for semiconductor devices Part 12: Sweep vibration
GB/T 2423.10-2008 Environmental testing of electrical and electronic products Part 2: Test method test Fc: Vibration (sinusoidal)
IEC 60749-12: 2002 Mechanical and climatic test methods for semiconductor devices Part 12: Swept vibration
