Test Background
The purpose of the semiconductor device chip shear strength test is to determine the integrity of the materials and process steps used to mount semiconductor chips on tube sockets or other substrates. It is suitable for cavity packaging and can also be used as process monitoring. It is not suitable for chips with an area larger than 10 mm2, as well as flip-chips and flexible substrates.
Zhongke Testing Environmental Reliability Experiment Center has various mechanical and climatic testing equipment for semiconductor devices, has chip shear strength testing capabilities, and provides professional chip shear strength testing services for semiconductor devices and equipment.
Test method
Using specified equipment, apply stress to the chip sufficient to cause it to be sheared from the mounting surface or apply stress to the chip that is twice the specified minimum shear strength, whichever is less.
The breakaway category is as follows:
a) Chip material remains when the chip is cut;
b) The chip is separated from the attachment material;
c) The chip and chip attachment material are separated from the tube holder.
Test standard:
GB/T 4937.1-2006 Mechanical and climatic test methods for semiconductor devices Part 1: General
GB/T 4937.19-2018 Mechanical and climatic test methods for semiconductor devices Part 19: Chip shear strength
IEC 60749-19: 2010 Mechanical and climatic test methods for semiconductor devices Part 19: Chip shear strength
