Mold growth test on electrical and electronic products

Mold growth in electronic and electrical products will cause product structural damage and performance degradation, product failure or even damage, such as rapid aging of wire insulation layers, embrittlement of rubber, failure of sealing rings, short-circuit burning of components, failure of insulation performance, dimming of metal luster, blurring of optical lenses, etc.
In short, the consequences of mold growth on electronic and electrical products are very serious, ranging from affecting the quality and appearance of the product to causing product failure or even causing major quality accidents. The mold growth test on electronic and electrical products can determine the degree of mold growth on electronic products and the impact of mold growth on product characteristics and other related performance.
Zhongke Testing Reliability Experiment Center has environmental testing capabilities for various electrical and electronic products, and provides professional mold growth testing services for electrical and electronic products.

First, inspect the sample with the naked eye. If necessary, use a stereomicroscope to magnify it about 50 times. Rate and describe mold growth on the following scale:
Level 0: No obvious mold growth was found under 50x magnification.
Level 1: Traces of mold growth are seen under a microscope.
Level 2a: Sparse mold growth is seen with the naked eye or scattered and local mold growth is seen under a microscope. The mold growth area does not exceed 5% of the test area.
Level 2b: It is obvious to the naked eye that mold grows more or less uniformly in many places, and the mold-growing area does not exceed 25% of the test area.
Level 3: Mold growth is clearly visible to the naked eye, and the mold growth area exceeds 25% of the tested area.

Test method 1
After 28 days of cultivation, it was determined:
1) Appearance inspection to determine the degree of mold growth;
2) Physical damage caused by mold growth;
3) Effects of mold growth on functional and/or electrical properties, if required in relevant specifications.
If relevant specifications require checking functionality and/or measuring electrical properties, the incubation period should be extended to 56 d.
Test method 2
After pretreating the sample with nutrient solution, culture it for 28 days and determine:
1) Appearance inspection to determine the degree of mold growth;
2) Physical damage caused by mold growth;
3) The impact of mold growth on functional and/or electrical properties, if required in relevant specifications. By using nutrient solutions to simulate contamination of non-mold-growing samples, the mold-resistant properties of the sample surface will be reduced.
0 This effect should be taken into account if functionality is checked and/or electrical properties are measured. Mold will occur when using nutrient solutions; if there is no mold, the impact of antifungal agents should be considered.

GB/T 2423.16-2008 Environmental testing of electrical and electronic products Part 2: Test methods Test J and guidelines: Mold growth
IEC 60068-2-10: 2005 Environmental Testing Part 2: Test Method Test J and Guidelines: Mold Growth
GB/T27025-2008 General requirements for testing and calibration laboratory capabilities
ISO 846: 1997 Plastics - Evaluation of microbial effects
MIL-STD-810 F:2000 Method 508.5 Fungi