Test Background
The purpose of the rapid temperature change test of semiconductor devices is to test the product's ability to withstand repeated temperature extremes. Severe temperature changes may cause semiconductor devices: assembly points or soldering points to loosen or fall off, crack the material itself, change the performance of electronic components, and cause leakage due to seal failure.
Zhongke Testing Environmental Reliability Experiment Center has various mechanical and climatic test equipment for semiconductor devices, has rapid temperature change test capabilities, and provides professional rapid temperature change test services for semiconductor devices and equipment.
Test method
The sample should be placed in a suitable position in the liquid tank so that the flow of liquid in and around the sample is unimpeded. Then according to regulations, the load is subjected to 15 cycles under the specified test conditions (10 cycles should be carried out for simulated cleaning).
Interruption of testing is permitted for loading or unloading of device lots, or due to power or equipment failure. However, if the number of interruptions for any given test exceeds 10% of the total number of specified cycles, the test shall be restarted.
Test standard:
GB/T 4937.1-2006 Mechanical and climatic test methods for semiconductor devices Part 1: General
GB/T 4937.11-2018 Mechanical and climatic test methods for semiconductor devices Part 11: Rapid temperature changes Double bath method
IEC 60749-11: 2002 Mechanical and climatic test methods for semiconductor devices Part 11: Rapid temperature changes Double bath method
