Test Background
The purpose of the semiconductor device temperature and humidity storage test is to evaluate the ability of semiconductor devices to withstand high-temperature and high-humidity environments. It can also be used to evaluate the corrosion resistance of chip metallized interconnections of plastic-encapsulated semiconductor devices and other types of packaged semiconductor devices.
Zhongke Testing Environmental Reliability Experiment Center has various mechanical and climate test equipment for semiconductor devices, has temperature and humidity storage test capabilities, and provides professional temperature and humidity storage test services for semiconductor devices and equipment.
Test method
The device should be placed in the high temperature and high humidity test chamber specified in the procurement documents. When placing the device into and out of the test chamber, ensure that no small water droplets adhere to the device and that the device cannot come into contact with any condensed water vapor. When a plastic surface mount device needs to be fixed on a fixture, the applicable ordering document should specify the relevant conditions (circuit board material, flat surface dimensions, soldering method, flux cleaning, etc.).
Temperature was controlled from the beginning to the end of the test, and humidity was controlled during heating and cooling periods.
Test standard:
GB/T 4937.1-2006 Mechanical and climatic test methods for semiconductor devices Part 1: General
GB/T 4937.42 Mechanical and climatic test methods for semiconductor devices Part 42: Temperature and humidity storage
IEC 60749-20 Resistance to the combined effects of moisture and soldering heat on plastic surface mount devices
