Semiconductor device steady-state damp heat test

The purpose of the strongly accelerated steady-state damp heat test for semiconductor devices is to evaluate the reliability of non-hermetic packaged semiconductor devices in humid environments. The strongly accelerated steady-state hygrothermal test accelerates moisture penetration through the external protective material (potting or sealing) or the interface between the external protective material and the metal conductor by applying severe temperature, humidity and bias conditions. The failure mechanism generated by this test stress is generally the same as the "85/85" steady-state temperature and humidity bias life test.
Zhongke Testing Environmental Reliability Experiment Center has various mechanical and climatic test equipment for semiconductor devices, has strong accelerated steady-state damp heat test capabilities, and provides professional strongly accelerated steady-state damp heat test services for semiconductor devices and equipment.

The device under test should be installed in a certain way. Exposed to the specified temperature and humidity environment, and the specified bias voltage should be applied.
Devices should be protected from exposure to overheating, drying, or environments that would cause condensation on the device and electrical fixtures, especially during the rise and fall of test stress.

GB/T 4937.1-2006 Mechanical and climatic test methods for semiconductor devices Part 1: General
GB/T 4937.4-2012 Mechanical and climatic test methods for semiconductor devices Part 4: Highly accelerated steady-state hot and humid test (HAST)