Semiconductor device environmental testing

Semiconductor devices are electronic devices whose conductivity is between good conductors and insulators. They use the special electrical properties of semiconductor materials to complete specific functions. They can be used to generate, control, receive, transform, amplify signals and perform energy conversion. During the manufacturing, transportation, storage and use of semiconductor devices, they are easily affected by the harmful effects of surrounding climate and environmental factors.
With the advancement of science and technology, especially the development of aerospace technology, the environment in which various semiconductor devices operate may become more complex and harsh. This requires that the impact of expected environmental factors on semiconductor devices should be considered when starting research and development, and corresponding protective measures should be taken.
Semiconductor device environmental testing is to expose semiconductor devices and equipment to natural environments and artificial simulated environments to evaluate their performance during storage, transportation and use that may actually be encountered. Zhongke Testing Environmental Reliability Experiment Center has various semiconductor device environmental testing equipment, has environmental testing capabilities, and provides professional environmental testing services for semiconductor devices and equipment.

Common semiconductor devices mainly include two-terminal, three-terminal and four-terminal devices.
Devices at both ends include: diodes (rectifier diodes), Gunn diodes, impulse diodes, laser diodes, Zener diodes, Schottky diodes, PIN diodes, tunnel diodes, light emitting diodes (LEDs), phototransistors, photodiodes, solar cells, TVS diodes, VCSELs;
Three-terminal devices include: bipolar transistors, field effect transistors, Darlington transistors, insulated gate bipolar transistors (IGBTs), unijunction transistors, thyristors, thyristors, triacs;
Four-terminal devices include: optocoupler (optical coupler), Hall effect sensor (magnetic field sensor).

Climatic environment test: low pressure test, heat and humidity test, life test, high temperature test, durability test, rapid temperature change test, salt spray test, moisture resistance test, high temperature working life, temperature cycle test, high pressure cooking test
Other environmental tests: sealing test, impact test, vibration test, strength test, welding heat resistance test, shear strength, bonding strength, flammability test, drop test

GB/T 4937.1-2006 Mechanical and climatic test methods for semiconductor devices Part 1: General
GB/T 4937.2-2006 Mechanical and climatic test methods for semiconductor devices Part 2: Low pressure
GB/T 4937.4-2012 Mechanical and climatic test methods for semiconductor devices Part 4: Highly accelerated steady-state hot and humid test (HAST)
EN 60749-5-2003 Mechanical and climatic test methods for semiconductor devices Part 5: Steady-state temperature and humidity deviation life test
EN 60749-6-2002 Mechanical and climatic test methods for semiconductor devices Part 6: High temperature storage
GB/T 4937.8 Mechanical and climatic test methods for semiconductor devices Part 8: Sealing
IEC 60749-9:2017 Semiconductor devices - Mechanical and climatic test methods - Part 9: Persistence of tags
GB/T 4937.10 Mechanical and climatic test methods for semiconductor devices Part 10: Mechanical shock
GB/T 4937.11-2018 Mechanical and climatic test methods for semiconductor devices Part 11: Rapid temperature changes Double liquid tank method
GB/T 4937.12-2012 Mechanical and climatic test methods for semiconductor devices Part 12: Sweep vibration
GB/T 4937.13-2018 Mechanical and climatic test methods for semiconductor devices Part 13: Salt spray
0 GB/T 4937.14-2018 Mechanical and climatic test methods for semiconductor devices Part 14: Terminal strength (lead solidity)
1 GB/T 4937.15-2018 Mechanical and climatic test methods for semiconductor devices Part 15: Soldering heat resistance of through-hole mounted devices
2 GB/T 4937.19-2018 Mechanical and climatic test methods for semiconductor devices Part 19: Chip shear strength