Failure Analysis

device failure refers to the complete or partial loss of its function, parameter drift, or the intermittent occurrence of the above conditions. Failure mode is the external macroscopic manifestation of product failure, including open circuit, short circuit, on and off, functional abnormalities, parameter drift, etc. According to the failure mechanism. Failure can be divided into structural failure, thermal failure, electrical failure, corrosion failure, etc.

(1) Non-destructive analysis:
X-ray fluoroscopic inspection, ultrasonic scanning inspection, electrical performance test, morphology test, local component analysis
(2) Destructive analysis:
Unsealing inspection, profile analysis, probe testing, focused ion beam analysis, thermal performance testing, overall composition testing, mechanical performance testing, etc.