Semiconductor device gas diffusivity and water dissolution rate test

Two material properties, moisture diffusivity and water solubility rate, are important parameters that effectively characterize the reliability of plastic-encapsulated semiconductor devices after they are exposed to moisture and undergo high-temperature reflow soldering. Zhongke Testing Environmental Reliability Experiment Center has various mechanical and climatic test equipment for semiconductor devices, has the ability to test gas diffusivity and water dissolution rate, and provides professional gas diffusivity and water dissolution rate testing services for semiconductor devices and equipment.

1. Sample preparation
2. Moisture absorption measurement below 100C
3. Calculation of solubility and diffusivity
4. Moisture absorption measurement above 100C
5. Calculate the activation energy of moisture diffusion

GB/T 4937.39 Mechanical and climatic test methods for semiconductor devices Part 39: Measurement of moisture diffusivity and water dissolution rate of raw materials for semiconductor devices
IEC 60749-39 Mechanical and climatic test methods for semiconductor devices Part 39: Measurement of moisture diffusivity and water solubility of raw materials for semiconductor devices
GB/T 4937.1-2006 Mechanical and climatic test methods for semiconductor devices Part 1: General principles