Test Background
Soldering heat testing can increase the pressure of moisture in the SMD (which the SMD absorbs during storage), causing the SMD plastic package to crack and cause electrical performance failure. The comprehensive soldering heat test of semiconductor devices evaluates the soldering heat resistance of SMDs by simulating the moisture absorbed by SMDs stored in warehouses or dry packaging environments.
Zhongke Testing Environmental Reliability Experiment Center has various mechanical and climatic test equipment for semiconductor devices, has comprehensive welding heat testing capabilities, and provides professional comprehensive welding heat testing services for semiconductor devices and equipment.
Test method
1. Preliminary test: appearance inspection, electrical test, acoustic scanning internal inspection
2. Dry
3. Water vapor dipping: SMD test conditions for non-dry packaging, water vapor dipping for dry packaging SMD
4. Welding heat: heating method of infrared convection or convection reflow soldering, heating method of vapor phase reflow soldering, heating method of wave soldering
5. Recovery 6. Final inspection: appearance inspection, electrical characteristics test, acoustic scanning inspection
Test standard:
GB/T 4937.1-2006 Mechanical and climatic test methods for semiconductor devices Part 1: General
GB/T 4937.20-2018 Mechanical and climatic test methods for semiconductor devices Part 20: Resistance to the combined effects of moisture and soldering heat on plastic surface-mounted devices
IEC 60749-20: 2008 Mechanical and climatic test methods for semiconductor devices Part 20: Resistance to the combined effects of moisture and soldering heat on plastic surface-mounted devices
IEC 60068-2-20: 2008 Environmental Testing of Electrical and Electronic Products Part 2-20: Test Method Test T: Test Method for Solderability and Soldering Heat Resistance of Leaded Devices
