Test Background
The purpose of the soldering heat resistance test of semiconductor devices is to determine the ability of through-hole mounted solid-state packaged devices to withstand the thermal stress generated when wave soldering or soldering iron leads are soldered. The soldering heat resistance test of semiconductor devices is to determine the ability of the device to withstand the required soldering temperature when assembled onto a circuit board. It is required that the electrical performance of the device does not degrade and that the internal connections are not damaged. The soldering heat resistance test of semiconductor devices is a destructive test and can be used for identification, batch receipt and product inspection.
Zhongke Testing Environmental Reliability Experiment Center has various mechanical and climatic test equipment for semiconductor devices, has soldering heat resistance test capabilities, and provides professional soldering heat resistance test services for semiconductor devices and equipment.
Test method
Before the test, fix the test sample on the dip soldering device, and dip the leads into the molten solder until the distance between the device body and the liquid level meets the requirements. Solder temperature, residence time, number of immersions, immersion and extraction rates must meet regulations. After the dip soldering process, the samples were allowed to cool in air.
If flux is used, isopropyl alcohol or rubbing alcohol should be used to remove the residue. In accordance with the provisions of relevant documents, conduct appearance inspection, electrical performance testing (including electrical parameter testing and functional testing) and sealing inspection of sealing devices.
Test standard:
GB/T 4937.1-2006 Mechanical and climatic test methods for semiconductor devices Part 1: General
GB/T 4937.15-2018 Mechanical and climatic test methods for semiconductor devices Part 15: Soldering heat resistance of through-hole mounted devices
GB/T 2423.28- 2005 Environmental testing of electrical and electronic products Part 2: Test method Test T: Soldering
IEC 60749-15: 2010 Mechanical and climatic test methods for semiconductor devices Part 15: Resistance to soldering heat of through-hole mounted devices
