Test Background
The purpose of the semiconductor device terminal strength test is to determine the lead/package interface and the solidity of the leads. This test is performed when the leads are bent due to incorrect assembly of the circuit board and the leads are reshaped for reassembly. The terminal strength test of semiconductor devices is a destructive test and is only suitable for qualification testing.
Zhongke Testing Environmental Reliability Experiment Center has various mechanical and climatic testing equipment for semiconductor devices, has terminal strength testing capabilities, and provides professional terminal strength testing services for semiconductor devices and equipment.
Test method
1. Lead fatigue test: used to apply bending stress multiple times, mainly used to measure the resistance of the lead to metal fatigue when bent multiple times.
2. Lead torque test: This test condition is used to apply stress to the lead to determine the sealing and lead torsion resistance. This test is used to check the torsion resistance of device leads and seals.
3. Bolt torque test: It is suitable for the stress caused by the extrusion of the threaded bolt-type device during assembly, and checks the resistance of the threaded bolt-type device to the pressure caused by the extrusion of the device during assembly.
Test standard:
GB/T 4937.1-2006 Mechanical and climatic test methods for semiconductor devices Part 1: General
GB/T 4937.14-2018 Mechanical and climatic test methods for semiconductor devices Part 14: Terminal strength (lead solidity)
IEC 60749-14: 2003 Mechanical and climatic test methods for semiconductor devices Part 14: Terminal strength (lead robustness)
IEC 60749-8 Mechanical and climatic test methods for semiconductor devices Part 8: Sealing
