Semiconductor device sealing test

In order to prevent the performance degradation caused by contamination of water vapor and other impurities on the surface of semiconductor equipment, integrated circuits and other components, they must be sealed with tubes and shells. However, due to various reasons, the joints or lead joints of the tube casing often produce some small holes that are difficult to find with the naked eye. Therefore, after the components are packaged, some method needs to be taken to detect the presence of these holes.
The purpose of the semiconductor device sealing test is to detect the leakage rate of the semiconductor device. Zhongke Testing Environmental Reliability Experiment Center has various mechanical and climatic test equipment for semiconductor devices, has sealing test capabilities, and provides professional sealing test services for semiconductor devices and equipment.

1, detailed leak detection: radioactive krypton method
After pressurizing the chamber with appropriate radioactive tracer gas, the radioactivity intensity present inside the device is measured to determine the leakage rate of the semiconductor device. It is suitable for devices hermetically sealed by glass, metal or ceramic (or their combination).
2, detailed leak detection: tracer gas (helium) method using mass spectrometer
Applicable to all cavity-type packages, except that the tracer gas pressure is single. The mechanical strength of the package changes with size, wall thickness to area ratio, material and structure, etc.
3, rough leak detection: perfluorocarbon gas method using electronic detector0 The leak rate of a semiconductor device is determined by pressurizing the semiconductor device immersed in a liquid and measuring the amount of perfluorocarbon escaping from the device. It is suitable for devices hermetically sealed by glass, metal or ceramic (or their combination). 1 24, other methods: 34 Rough leak detection: perfluorocarbon bubble detection method 5 Weight gain rough leak detection method 6 Dye Penetration Rough Leak Detection Method7 Rough leak detection and re-inspection

GB/T 4937.1-2006 Mechanical and climatic test methods for semiconductor devices Part 1: General
GB/T 4937.8 Mechanical and climatic test methods for semiconductor devices Part 8: Sealing
IEC 60749-8:2002 Mechanical and climatic test methods for semiconductor devices Part 8: Sealing
GB/T 2423.23-2013 Environmental testing Part 2: Test method Test Q: Sealing