Test Background
The purpose of low-pressure testing of semiconductor devices is to measure the ability of components and materials to avoid electrical breakdown failure, which is caused by the weakening of the dielectric strength of air and other insulating materials when the air pressure is reduced. The low-pressure test of semiconductor devices is only applicable to devices with operating voltages exceeding 1,000 V.
Zhongke Testing Environmental Reliability Experiment Center has various mechanical and climatic testing equipment for semiconductor devices, has low pressure testing capabilities, and provides professional low pressure testing services for semiconductor devices and equipment.
Test method
The sample should be placed in a sealed chamber as specified, and the air pressure should be reduced to a certain test condition as specified. Keep the samples under the specified pressure and subject them to the specified tests. During the test and within 20 minutes before the test, the test temperature should be 25C±10C.
Apply a specified voltage to the device, and monitor whether the device malfunctions during the entire process from normal pressure to the specified minimum pressure and back to normal pressure.
Test standard:
GB/T 4937.1-2006 Mechanical and climatic test methods for semiconductor devices Part 1: General
GB/T 4937.2-2006 Mechanical and climatic test methods for semiconductor devices Part 2: Low pressure
IEC 60068-2-13 Environmental testing Part 2: Test M: Low air pressure
