High pressure cooking test

The high-pressure cooking test is a high-temperature, high-humidity, and high-pressure test. It mainly tests the comprehensive impact of electronic devices such as plastic-encapsulated semiconductor integrated circuits and air-sealed devices. It uses a highly accelerated test method to evaluate the ability of electronic products to withstand moisture, heat and sealing. It is used in electronic product quality assessment, failure analysis, reliability testing, etc. The temperature range of the high-pressure cooking test is 105~142.9℃, the humidity range is 75%~100%RH, and the pressure range is 0.02~0.186Mpa.
Zhongke Testing Environmental Reliability Experiment Center has various climate environment simulation test equipment and high-pressure cooking test capabilities. It provides professional high-pressure cooking test services for various types of national defense, aerospace, automotive parts, electronic parts, plastics and other products.

National defense, aerospace, automotive parts, electronic spare parts, plastics, magnetic materials, single-layer circuit boards, multi-layer circuit boards, lighting, lighting products and other products.

GB/T 4937.4-2012 Semiconductor devices - Mechanical and climatic test methods - Part 4: Highly accelerated steady-state hot and humid test (HAST)
JESD22-A110D-2010 Highly Accelerated Humid Heat Stress Test
IPC/JEDECJ-STD-020D.1-2008 Non-hermetic solid-state surface mount devices Moisture/Reflow Sensitivity Classification