Quality identification of chip interconnection equipment

chip interconnection equipment uses micro-nano-scale precision interconnection technology as its core principle. By optimizing micro-bump eutectic bonding accuracy, hot-press bonding temperature control and interface material reliability, it achieves high-density chip packaging, signal integrity and long-term reliability. It is widely used in fields such as advanced packaging, Chiplet heterogeneous integration and sensor modules. In high-performance computing, it is used for micro-bump interconnection between silicon interposers and logic chips; in the field of automotive electronics, it meets the high temperature and vibration resistance requirements of on-board chips; in consumer electronics, it ensures low-latency transmission of 5G radio frequency modules. Compared with traditional wire bonding, chip interconnection equipment has the characteristics of high interconnection density, excellent electrical performance and strong process stability, and is the core equipment of advanced semiconductor packaging.

Zhongke Testing is a product quality appraisal service organization registered with the court. It can provide quality appraisal services for chip interconnection equipment. It has a professional appraisal team and advanced instruments and equipment to provide fair and accurate appraisal results for the quality appraisal of chip interconnection equipment.

As the complexity of heterogeneous integration technology increases, related quality dispute cases have increased significantly. The judicial dispute focuses on:

1, performance index dispute: bonding strength is not up to standard, high-frequency signal crosstalk exceeds standard;

2, material defects: micro-bump SnAg solder composition deviation, underfill CTE mismatch;

3. Process problems: The thermal pressure bonding temperature gradient is out of control, and the surface oxygen concentration remains after plasma cleaning;

4. Contract performance disputes: The core modules (such as laser-assisted bonding system, nanoscale alignment platform) are not consistent with the technical agreement.

Chip interconnection equipment litigation quality appraisal usually uses the following technical methods:

1. Appearance inspection

Visually or microscopically inspect the appearance of the equipment to observe whether there are defects such as poor welding, bent pins, surface scratches, etc.

2. Electrical testing

uses resistance meter, inductance meter and other equipment to measure the electrical characteristics of the equipment, such as resistance, inductance, capacitance, etc.

0Evaluates the stress resistance of the device through thermal cycling, vibration or shock testing.

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A sealing and testing factory of the applicant signed a "Flip Chip Soldering Equipment Purchase Contract" with an equipment manufacturer of the respondent, and it was agreed that the bonding strength should be ≥60MPa. The chip interconnection failure rate in mass production exceeds 10%, and manufacturers argue that it is caused by surface contamination of customer chips.

identification analysis results:

The quality analysis expert group discussed and comprehensively analyzed the relevant information of "chip interconnection equipment", contract technical agreements, on-site inspection case materials and other data, and made the following quality analysis opinions:

The bonding temperature control module of the chip interconnect equipment involved in the case has a deviation of ±15℃ (protocol ±5℃), resulting in uneven IMC layer thickness (0.3-3μm); the solder Ag content is only 1.8% (protocol 3.0-3.5%), and the shear strength is only 35MPa; after plasma cleaning, the surface oxygen remains at 8at% (protocol ≤ 3at%).

The appraisal conclusion determined that process control defects and material composition deviations were the main causes of failure.

Chip interconnect equipment quality appraisal report should include:

1, appraisal purpose (such as failure attribution, performance verification) and referenced standards (IPC-7095, JEDEC JESD22-A104, etc.);

2, equipment model involved, process parameter records, production batches;

3, detection methods and equipment list (such as SEM-EDS, network analyzer);

4, test data and failure correlation analysis (such as the impact of Ag content on bonding strength);