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Vehicle-mounted computing equipment quality qualification

Vehicle-mounted computing equipment quality qualification-Machinery & Equipment-CAS Testing Technical Services (Hong Kong) Company Limited

In-Vehicle Computing Device QualityAppraisal Background

in-vehicle computing equipment uses the core principle of high-performance computing and car-grade reliability as its core principle. By optimizing heterogeneous computing power allocation, environmental adaptability and functional safety levels, it achieves the synergy of autonomous driving decision-making delay, multi-sensor data fusion accuracy and system redundancy design. It is widely used in fields such as intelligent driving, in-vehicle infotainment, Internet of Vehicles and electrification control. In autonomous driving, it is used for real-time environment perception and path planning; in the smart cockpit field, it meets the low-latency requirements of multi-screen interaction and voice recognition; in the three-power system, it ensures the accuracy of battery management and motor control. Compared with consumer-grade computing equipment, vehicle-mounted computing equipment has the characteristics of strong earthquake resistance, excellent electromagnetic compatibility, and long life cycle. It is the core hub of the electronic and electrical architecture of smart cars.

Zhongke Testing is a product quality appraisal service organization registered with the court. It can provide quality appraisal services for vehicle-mounted computing equipment. It has a professional appraisal team and advanced instruments and equipment to provide fair and accurate appraisal results for the quality appraisal of vehicle-mounted computing equipment.


In-Vehicle Computing Device QualityIdentify points of contention

With the popularization of smart cars, related quality dispute cases have increased significantly. The judicial dispute focuses on:

1, performance indicator dispute: computing power output fails to meet standards, functional safety response times out;

2, material defects: BGA package solder joint void rate, heat dissipation substrate Thermal conductivity;

3, process issues: PCB impedance control deviation, uneven coverage of three-proof coating;

4, contract performance dispute: core chip model, software certification and technical agreement are inconsistent.

0 Such cases need to pass computing power benchmark testing, failure mode analysis and safety certification verification to clarify the quality responsibility.

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In-Vehicle Computing Device QualityIdentification method

1. Performance test

conducts functional and performance tests on the device to evaluate whether it meets the design requirements.

2. Hardware Inspection

Inspect the device's hardware components, such as circuit boards, connectors, and sensors; look for manufacturing defects, damage, or signs of aging.

3. Software Analysis

0Analyze the device's software code to identify potential flaws or failure points; use static and dynamic analysis tools such as code review and debugging.

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24. Data Analysis

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4Analyzes data generated by the device, including log files and event records; looking for failure modes, outliers, or other indications of quality issues.

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In-Vehicle Computing Device QualityAuthentication case

A car company of the applicant signed an "Autonomous Driving Domain Controller Procurement Contract" with a supplier of the respondent, agreeing that the computing power is ≥100TOPS. In the actual vehicle test, the perceived delay exceeded 100ms, and the manufacturer argued that the sensor data source was abnormal.

Identification analysis results:

The quality analysis expert group discussed and comprehensively analyzed the relevant information of "vehicle computing equipment", contract technical agreements, on-site inspection case materials and other data, and made the following quality analysis opinions: HTMLTAGTOKEN The NPU computing power of the vehicle-mounted computing equipment involved in 5

is only 80TOPS (protocol ≥100TOPS), the thermal resistance of the heat dissipation substrate is >1.5℃/W (protocol ≤0.8℃/W), and frequency reduction is triggered at high temperatures; the BGA solder joint void rate is 18%, and 5% of the solder joints are broken during the vibration test; the functional safety monitoring period is 120ms (ASIL-D requirement ≤100ms).

The appraisal conclusion concluded that insufficient computing power and process defects were the main causes of performance failure.

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In-Vehicle Computing Device QualityContents of the appraisal report

The vehicle computing equipment quality appraisal report should include:

1, the purpose of the appraisal (such as functional safety disputes, performance verification) and referenced standards (ISO 26262, GB/T 28046, etc.);

2, equipment model, hardware version, production batch;

3, detection method and equipment list (such as thermal imaging camera, X-ray machine);

4. Analysis of the correlation between testing data and failure (such as the impact of heat dissipation design on computing power);

05. Clarify the quality responsibility determination conclusion and technical basis;

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26. Functional safety engineer qualification certificate of the appraiser and the official seal of the organization.

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