Chip Quality Identification

Chip refers to a silicon chip containing integrated circuits. It is very small and is often part of a computer or other equipment. Chip is the collective name for semiconductor component products. It is the carrier of integrated circuits and is divided from wafers. A silicon wafer is a small piece of silicon that contains an integrated circuit and is part of a computer or other electronic device.

The main function of the chip is to complete calculations and processing tasks. The chip refers to the silicon chip containing the integrated circuit. The chip is as flexible as the human brain. The circuit can be manufactured on the surface of the semiconductor chip to perform calculations and processing, and output specific instructions and data.

Zhongke Testing provides chip quality identification services.

GB/T 4937.19-2018 Semiconductor devices - Mechanical and climatic test methods Part 19: Chip shear strength
GB/T 36356-2018 Technical specifications for power semiconductor light-emitting diode chips
GB/T 36357-2018 Technical specifications for medium-power semiconductor light-emitting diode chips
GB/T 36356-2018 Technical specifications for power semiconductor light-emitting diode chips
GB/T 35010.8-2018 Semiconductor chip products Part 8: EXPRESS format for data exchange
GB/T 35010.7-2018 Semiconductor chip products Part 7: XML format for data exchange
GB/T 35010.3-2018 Semiconductor chip products Part 3: Handling, packaging and storage guidelines
GB/T 35010.2-2018 Semiconductor chip products Part 2: Data exchange format
GB/T 35010.5-2018 Semiconductor chip products Part 5: Electrical simulation requirements
DB35/T 1193-2011 Semiconductor light-emitting diode chip
0SJ/T 11399-2009 Test method for semiconductor light-emitting diode chip
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The court entrusted our company to conduct a quality analysis of the LED chips involved in the case to determine whether there are any quality issues related to breakage after packaging, SMT or welding processes. The analysis expert group discussed and comprehensively technical analyzed the relevant information, on-site investigation and inspection results of the "LED chip" involved in the case, and made the following LED chip quality appraisal analysis opinions:
The "LED chip" involved in the case had chip breakage quality problems after being packaged and SMT. Its quality level did not meet the acceptance requirements of the "Quality Assurance Agreement", and the chip breakage quality problem was caused by its own quality problems.