Appraisal Background
There are many control points in the entire PCB production process. If they are not rigorous, circuit board quality problems will emerge in endlessly. Common problems: delamination, poor solderability, board bending and warping, scratches, exposed copper, poor impedance, BGA solder voids, solder mask blistering/falling off, poor plug holes, poor size, Jiafanid effect, etc.
Zhongke Testing provides electronic and electrical quality appraisal services. It can conduct appraisal work on whether there are problems with PCB-related quality, issue professional and reliable inspection reports, and assist courts and enterprises in resolving product quality disputes.
Basis for appraisal
QJ 2830-1996 Printed circuit board guide rail specification
QJ 3103A-2011 Printed circuit board design requirements
QJ 201A-1999 Printed circuit board general specification
QJ 519A-1999 Printed circuit board test method
QJ 2152-1991 Technical specifications for flexible printed circuit boards
QJ 518-1980 Printed circuit board dimensions series
SJ 21150-2016 Microwave component printed circuit board design guide
QJ 831B-2011 General specifications for multilayer printed circuit boards for aerospace use
Authentication case
A certain electrical appliance factory purchased a batch of PCB circuit boards for use in the production of home appliances. Due to the high rate of product failure, the home appliance manufacturer conducted an investigation and ultimately identified the cause as the PCB circuit board. After negotiation with the supplier, both parties jointly entrusted our company to conduct quality appraisal of this batch of circuit boards. The
expert group tested this batch of PCB circuit board design experiments and found that this batch of circuit boards had the following problems:
1. The welds were not full, and parts easily fell off due to poor welding, seriously affecting the quality of the circuit boards;
2. The materials did not meet the technical requirements, and the copper surface was prone to oxidation, which affected the installation speed. After oxidation, it was prone to failure;
3. The deformation error of the circuit board's hole position and circuit design is relatively high, resulting in the shell being easily deformed after installation and the screw holes being misaligned;
4, this batch of circuit boards does not meet the relevant standards and is considered substandard.
